THe ILC Future Logging Workforce Scholarship
The ILC Future Logging Workforce Scholarship is being presented at the 2024 ILC to encourage and reward students who are looking to further their education in the timber industry. The scholarship is open to students enrolled in a forestry related program in Washington, Idaho, Montana or Oregon pursuing future careers in logging, forest products, and the many trades we rely on to support the logging workforce. This includes but is not limited to technical degrees, certificate training, 2-year programs, and 4-year programs in forest operations and technology, diesel technology, industrial maintenance/ millright technology, welding technology, or related programs, as long as the student is planning to pursue a career related to the logging and forest products industry.
The $1,500 scholarship will be presented on behalf of the Intermountain Logging Conference. Applications will be evaluated based on academic performance and career focus on working in logging, forest products, or any of the supporting services we rely on in the region.n.
To Apply
Download the attached application form and a current copy of your resume. Please use as much space as needed to answer each question. These should be completed and returned electronically to Brian Hobday, Chair, Future Logging Workforce Scholarship Selection Committee, at the following email address:
The deadline for submitting the application is COB Monday, March 15th, 2024.
Application Checklist:
Current Resume (Please include current GPA)
Scholarship Presentation:
This scholarship will be presented to the chosen applicant at the 84th Annual Intermountain Logging Conference and Equipment Show, which will be held at The Mirabeau Park Hotel and Convention Center, Spokane Valley, Washington, on April 3-4, 2024.
In order to be selected and receive the award, the applicant must attend the ILC to receive the award in person as part of the program at lunchtime on Thursday, April 4th, 2024.
If you have any questions about the application, please email Rob Keefe (robk@uidaho.edu) or Brian Hobday (brian.hobday@greendiamond.com).